Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 038649/0418 | |
| Pages: | 5 |
| | Recorded: | 05/19/2016 | | |
| Attorney Dkt #: | THP-DNP-16011 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/09/2019
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Application #:
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15159323
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Filing Dt:
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05/19/2016
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Publication #:
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Pub Dt:
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09/22/2016
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Title:
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THROUGH-HOLE ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE USING THROUGH-HOLE ELECTRODE SUBSTRATE
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Assignee
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| 1-1-1, ICHIGAYA KAGACHO, SHINJUKU-KU |
| TOKYO, JAPAN 1628001 |
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Correspondence name and address
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TYPHA IP LLC
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1819 L STREET NW SUITE 200
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WASHINGTON, DC 20036
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