Patent Assignment Details
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Reel/Frame: | 007909/0419 | |
| Pages: | 3 |
| | Recorded: | 04/22/1996 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/24/1997
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Application #:
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08588482
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Filing Dt:
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01/18/1996
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Title:
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METHOD AND CIRCUIT BOARD STRUCTURE FOR LEVELING SOLDER BALLS IN BALL GRID ARRAY SEMICONDUCTOR PACKAGES
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Assignees
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280-8 SUNGSU 2-GA SUNGDONG-KU |
SEOUL 133-120, KOREA, REPUBLIC OF |
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1347 N. ALMA SCHOOL ROAD, SUITE 100 |
CHANDLER, ARIZONA 85224 |
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Correspondence name and address
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SKJERVEN, MORRILL, MACPHERSON ET AL
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ALAN H. MACPHERSON
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25 METRO DRIVE, SUITE 700
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SAN JOSE, CA 95110
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