Patent Assignment Details
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Reel/Frame: | 026036/0419 | |
| Pages: | 6 |
| | Recorded: | 03/29/2011 | | |
Attorney Dkt #: | MIM0017US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/26/2013
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Application #:
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12942437
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Filing Dt:
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11/09/2010
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Publication #:
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Pub Dt:
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05/10/2012
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Title:
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HIGH MELTING POINT SOLDERING LAYER ALLOYED BY TRANSIENT LIQUID PHASE AND FABRICATION METHOD FOR THE SAME, AND SEMICONDUCTOR DEVICE
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Assignees
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21 SAIIN MIZOSAKI-CHO |
UKYO-KU, KYOTO-SHI |
KYOTO-FU, JAPAN |
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2404 NORTH UNIVERSITY AVENUE |
LITTLE ROCK, ARKANSAS 72207 |
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Correspondence name and address
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CANTOR COLBURN LLP
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20 CHURCH STREET
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22ND FLOOR
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HARTFORD, CT 06103
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