Patent Assignment Details
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| Reel/Frame: | 061694/0419 | |
| Pages: | 7 |
| | Recorded: | 11/08/2022 | | |
| Attorney Dkt #: | 766161 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17998191
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Filing Dt:
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11/08/2022
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Publication #:
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Pub Dt:
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07/20/2023
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Title:
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METHOD OF MANUFACTURING BARRIER-METAL-FREE METAL INTERCONNECT STRUCTURE, AND BARRIER-METAL-FREE METAL INTERCONNECT STRUCTURE
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Assignee
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| 11-1, HANEDA ASAHI-CHO, OTA-KU |
| TOKYO, JAPAN 1448510 |
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Correspondence name and address
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LEYDIG, VOIT & MAYER, LTD.
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TWO PRUDENTIAL PLAZA, SUITE 4900
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CHICAGO, IL 60601-6745
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