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Reel/Frame:063964/0419   Pages: 14
Recorded: 06/15/2023
Attorney Dkt #:099077.022140
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
18334527
Filing Dt:
06/14/2023
Publication #:
Pub Dt:
12/19/2024
Title:
PACKAGED DEVICE HAVING AN INTEGRATED PASSIVE DEVICE WITH WAFER LEVEL FORMED CONNECTION TO AT LEAST ONE SEMICONDUCTOR DEVICE AND PROCESSES FOR IMPLEMENTING THE SAME
Assignors
1
Exec Dt:
06/13/2020
2
Exec Dt:
06/13/2023
3
Exec Dt:
06/13/2023
4
Exec Dt:
06/14/2023
5
Exec Dt:
06/13/2023
6
Exec Dt:
06/13/2023
Assignee
1
4600 SILICON DRIVE
DURHAM, NORTH CAROLINA 27703
Correspondence name and address
BAKERHOSTETLER
1050 CONNECTICUT AVENUE, NW
SUITE 1100
WASHINGTON, DC 20036

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