Patent Assignment Details
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| Reel/Frame: | 066339/0419 | |
| Pages: | 3 |
| | Recorded: | 02/04/2024 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18431627
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Filing Dt:
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02/02/2024
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Publication #:
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Pub Dt:
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09/12/2024
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Title:
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CIRCUIT SUBSTRATE IN CHIP PACKAGE AND METHOD FOR FORMING THE SAME
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Assignee
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| 9F., NO. 23, JILIN RD. |
| JHONGLI INDUSTRIAL PARK, JHONGLI DIST. |
| TAOYUAN CITY, TAIWAN 32062 |
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Correspondence name and address
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WEN LIU
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17128 COLIMA ROAD #1808
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HACIENDA HEIGHTS, CA 91745
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09/21/2024 07:35 PM
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