Total properties:
49
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Patent #:
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|
Issue Dt:
|
10/31/2000
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Application #:
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08975403
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Filing Dt:
|
11/20/1997
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Title:
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PLASMA PROCESSING METHODS AND APPARATUS
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Patent #:
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Issue Dt:
|
08/01/2000
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Application #:
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09041284
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Filing Dt:
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03/11/1998
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Title:
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ARTICLE HOLDERS AND HOLDING METHODS
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Patent #:
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Issue Dt:
|
02/06/2001
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Application #:
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09083927
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Filing Dt:
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05/22/1998
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Title:
|
INTEGRATED CIRCUITS AND METHODS FOR THEIR FABRICATION
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Patent #:
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|
Issue Dt:
|
09/11/2001
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Application #:
|
09315122
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Filing Dt:
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05/19/1999
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Title:
|
PLASMA PROCESSING METHODS AND APPARATUS
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Patent #:
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Issue Dt:
|
11/27/2001
|
Application #:
|
09456225
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Filing Dt:
|
12/06/1999
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Title:
|
PACKAGING OF INTEGRATED CIRCUITS AND VERTICAL INTEGRATION
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Patent #:
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Issue Dt:
|
10/28/2003
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Application #:
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09466535
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Filing Dt:
|
12/17/1999
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Publication #:
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Pub Dt:
|
05/30/2002
| | | | |
Title:
|
INTEGRATED CIRCUITS AND METHODS FOR THEIR FABRICATION
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Patent #:
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|
Issue Dt:
|
11/27/2001
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Application #:
|
09519281
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Filing Dt:
|
03/07/2000
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Title:
|
Plasma processing methods and apparatus
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Patent #:
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|
Issue Dt:
|
07/16/2002
|
Application #:
|
09538869
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Filing Dt:
|
03/29/2000
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Title:
|
INTEGRATED CIRCUITS AND METHODS FOR THEIR FABRICATION
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|
Patent #:
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|
Issue Dt:
|
09/30/2003
|
Application #:
|
09542519
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Filing Dt:
|
04/03/2000
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Title:
|
PLASMA PROCESSING METHODS AND APPARATUS
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|
Patent #:
|
|
Issue Dt:
|
07/17/2001
|
Application #:
|
09617211
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Filing Dt:
|
07/17/2000
|
Title:
|
Plasma processing methods and apparatus
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|
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Patent #:
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|
Issue Dt:
|
10/14/2003
|
Application #:
|
09632236
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Filing Dt:
|
08/04/2000
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Title:
|
DETECTION AND HANDLING OF SEMICONDUCTOR WAFER AND WAFER-LIKE OBJECTS
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Patent #:
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|
Issue Dt:
|
07/23/2002
|
Application #:
|
09632485
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Filing Dt:
|
08/04/2000
|
Title:
|
MONITORING AND CONTROLLING SEPARATE PLASMA JETS TO ACHIEVE DESIRED PROPERTIES IN A COMBINED STREAM
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|
Patent #:
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|
Issue Dt:
|
02/17/2004
|
Application #:
|
09716092
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Filing Dt:
|
11/16/2000
|
Title:
|
PACKAGING OF INTEGRATED CIRCUITS AND VERTICAL INTEGRATION
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|
|
Patent #:
|
|
Issue Dt:
|
09/10/2002
|
Application #:
|
09752802
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Filing Dt:
|
12/28/2000
|
Publication #:
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|
Pub Dt:
|
05/17/2001
| | | | |
Title:
|
THINNING AND DICING OF SEMICONDUCTOR WAFERS USING DRY ETCH, AND OBTAINING SEMICONDUCTOR CHIPS WITH ROUNDED BOTTOM EDGES AND CORNERS
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Patent #:
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Issue Dt:
|
12/23/2003
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Application #:
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09757242
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Filing Dt:
|
01/08/2001
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Publication #:
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|
Pub Dt:
|
06/07/2001
| | | | |
Title:
|
BIRM AND GAS ESCAPE FOR NON-CONTACT WAFER HOLDER
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Patent #:
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Issue Dt:
|
04/06/2004
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Application #:
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09791977
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Filing Dt:
|
02/22/2001
|
Publication #:
|
|
Pub Dt:
|
08/22/2002
| | | | |
Title:
|
DEVICES HAVING SUBSTRATES WITH OPENING PASSING THROUGH THE SUBSTRATES AND CONDUCTORS IN THE OPENINGS, AND METHODS OF MANUFACTURE
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Patent #:
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Issue Dt:
|
12/24/2002
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Application #:
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09792311
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Filing Dt:
|
02/22/2001
|
Publication #:
|
|
Pub Dt:
|
08/22/2002
| | | | |
Title:
|
SEMICONDUCTOR STRUCTURES HAVING MULTIPLE CONDUCTIVE LAYERS IN AN OPENING, AND METHODS FOR FABRICATING SAME
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Patent #:
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Issue Dt:
|
12/24/2002
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Application #:
|
09876888
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Filing Dt:
|
06/06/2001
|
Publication #:
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|
Pub Dt:
|
01/31/2002
| | | | |
Title:
|
THINNING AND DICING OF SEMICONDUCTOR WAFERS USING DRY ETCH, AND OBTAINING SEMICONDUCTOR CHIPS WITH ROUNDED BOTTOM EDGES AND CORNERS
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|
Patent #:
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Issue Dt:
|
10/28/2003
|
Application #:
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09904700
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Filing Dt:
|
07/13/2001
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Publication #:
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Pub Dt:
|
01/16/2003
| | | | |
Title:
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ARTICLE HOLDERS AND ARTICLE POSITIONING METHODS
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Patent #:
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Issue Dt:
|
10/08/2002
|
Application #:
|
09922069
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Filing Dt:
|
08/02/2001
|
Publication #:
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|
Pub Dt:
|
02/14/2002
| | | | |
Title:
|
MONITORING AND CONTROLLING SEPARATE PLASMA JETS TO ACHIEVE DESIRED PROPERTIES IN A COMBINED STREAM
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|
Patent #:
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|
Issue Dt:
|
04/01/2003
|
Application #:
|
09922205
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Filing Dt:
|
08/02/2001
|
Publication #:
|
|
Pub Dt:
|
02/07/2002
| | | | |
Title:
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MONITORING AND CONTROLLING SEPARATE PLASMA JETS TO ACHIEVE DESIRED PROPERTIES IN A COMBINED STREAM
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Patent #:
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Issue Dt:
|
01/18/2005
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Application #:
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09941447
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Filing Dt:
|
08/28/2001
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Publication #:
|
|
Pub Dt:
|
08/22/2002
| | | | |
Title:
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FABRICATION OF SEMICONDUCTOR STRUCTURES HAVING MULTIPLE CONDUCTIVE LAYERS IN AN OPENING
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Patent #:
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Issue Dt:
|
04/19/2005
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Application #:
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10059898
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Filing Dt:
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01/28/2002
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Publication #:
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Pub Dt:
|
07/04/2002
| | | | |
Title:
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INTEGRATED CIRCUIT STRUCTURES WITH A CONDUCTOR FORMED IN A THROUGH HOLE IN A SEMICONDUCTOR SUBSTRATE AND PROTRUDING FROM A SURFACE OF THE SUBSTRATE
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Patent #:
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Issue Dt:
|
10/25/2005
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Application #:
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10109233
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Filing Dt:
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03/27/2002
|
Publication #:
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|
Pub Dt:
|
08/22/2002
| | | | |
Title:
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METHODS OF MANUFACTURING DEVICES HAVING SUBSTRATES WITH OPENING PASSING THROUGH THE SUBSTRATES AND CONDUCTORS IN THE OPENINGS
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Patent #:
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Issue Dt:
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02/10/2004
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Application #:
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10116462
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Filing Dt:
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04/02/2002
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Publication #:
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Pub Dt:
|
03/20/2003
| | | | |
Title:
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DETECTION AND HANDLING OF SEMICONDUCTOR WAFERS AND WAFER-LIKE OBJECTS
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Patent #:
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Issue Dt:
|
05/04/2004
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Application #:
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10127144
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Filing Dt:
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04/18/2002
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Publication #:
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Pub Dt:
|
10/23/2003
| | | | |
Title:
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CLOCK DISTRIBUTION NETWORKS AND CONDUCTIVE LINES IN SEMICONDUCTOR INTEGRATED
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Patent #:
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Issue Dt:
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05/25/2004
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Application #:
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10133595
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Filing Dt:
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04/26/2002
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Publication #:
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Pub Dt:
|
09/12/2002
| | | | |
Title:
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INTEGRATED CIRCUITS AND METHODS FOR THEIR FABRICATION
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Patent #:
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Issue Dt:
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12/16/2003
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Application #:
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10265056
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Filing Dt:
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10/04/2002
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Publication #:
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Pub Dt:
|
02/27/2003
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Title:
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ARTICLE HOLDERS WITH SENSORS DETECTING A TYPE OF ARTICLE HELD BY THE HOLDER
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Patent #:
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Issue Dt:
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12/16/2003
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Application #:
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10318833
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Filing Dt:
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12/12/2002
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Publication #:
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Pub Dt:
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05/08/2003
| | | | |
Title:
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INTEGRATED CIRCUITS AND METHODS FOR THEIR FABRICATION
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Patent #:
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Issue Dt:
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06/22/2004
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Application #:
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10352607
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Filing Dt:
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01/27/2003
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Publication #:
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Pub Dt:
|
08/07/2003
| | | | |
Title:
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METHOD FOR MANUFACTURING A STRUCTURE COMPRISING A SUBSTRATE WITH A CAVITY AND A SEMICONDUCTOR INTEGRATED CIRCUIT BONDED TO A CONTACT PAD LOCATED IN THE CAVITY
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Patent #:
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Issue Dt:
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05/24/2005
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Application #:
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10410929
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Filing Dt:
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04/09/2003
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Publication #:
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Pub Dt:
|
10/14/2004
| | | | |
Title:
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ELECTROPLATING AND ELECTROLESS PLATING OF CONDUCTIVE MATERIALS INTO OPENINGS, AND STRUCTURES OBTAINED THEREBY
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Patent #:
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Issue Dt:
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07/06/2004
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Application #:
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10412978
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Filing Dt:
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04/09/2003
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Title:
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WAFERING METHOD COMPRISING A PLASMA ETCH WITH A GAS EMITTING WAFER HOLDER
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Patent #:
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Issue Dt:
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02/20/2007
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10414603
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04/15/2003
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Publication #:
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Pub Dt:
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10/23/2003
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Title:
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PLASMA PROCESSING METHODS AND APPARATUS
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Patent #:
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06/13/2006
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10739707
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12/17/2003
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06/23/2005
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Title:
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PACKAGING SUBSTRATES FOR INTEGRATED CIRCUITS AND SOLDERING METHODS
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05/23/2006
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10739788
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12/17/2003
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Pub Dt:
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06/23/2005
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Title:
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INTEGRATED CIRCUITS AND PACKAGING SUBSTRATES WITH CAVITIES, AND ATTACHMENT METHODS INCLUDING INSERTION OF PROTRUDING CONTACT PADS INTO CAVITIES
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09/12/2006
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10756631
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01/12/2004
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08/05/2004
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Title:
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DETECTION AND HANDLING OF SEMICONDUCTOR WAFERS AND WAFER-LIKE OBJECTS
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07/10/2007
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10798540
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03/10/2004
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06/23/2005
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Title:
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ATTACHMENT OF INTEGRATED CIRCUIT STRUCTURES AND OTHER SUBSTRATES TO SUBSTRATES WITH VIAS
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02/21/2006
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11014464
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12/16/2004
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05/19/2005
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Title:
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SEMICONDUCTOR STRUCTURES HAVING MULTIPLE CONDUCTIVE LAYERS IN AN OPENING, AND METHODS FOR FABRICATING SAME
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04/25/2006
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11123532
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05/05/2005
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09/01/2005
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Title:
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PACKAGING SUBSTRATES FOR INTEGRATED CIRCUITS AND SOLDERING METHODS
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02/06/2007
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11131711
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05/18/2005
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Pub Dt:
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09/22/2005
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Title:
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CLOCK DISTRIBUTION NETWORKS AND CONDUCTIVE LINES IN SEMICONDUCTOR INTEGRATED CIRCUITS
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07/10/2007
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11253492
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10/19/2005
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02/23/2006
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Title:
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ATTACHMENT OF INTEGRATED CIRCUIT STRUCTURES AND OTHER SUBSTRATES TO SUBSTRATES WITH VIAS
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03/06/2007
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11253943
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10/19/2005
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02/16/2006
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Title:
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INTEGRATED CIRCUITS AND PACKAGING SUBSTRATES WITH CAVITIES, AND ATTACHMENT METHODS INCLUDING INSERTION OF PROTRUDING CONTACT PADS INTO CAVITIES
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03/31/2009
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11418801
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05/05/2006
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11/08/2007
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Title:
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DIELECTRIC TRENCHES, NICKEL/TANTALUM OXIDE STRUCTURES,AND CHEMICAL MECHANICAL POLISHING TECHNIQUES
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04/21/2009
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11548053
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10/10/2006
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06/07/2007
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Title:
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ELECTROPLATING AND ELECTROLESS PLATING OF CONDUCTIVE MATERIALS INTO OPENINGS, AND STRUCTURES OBTAINED THEREBY
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NONE
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11744046
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05/03/2007
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11/06/2008
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Title:
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AGITATION OF ELECTROLYTIC SOLUTION IN ELECTRODEPOSITION
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01/21/2014
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11866186
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10/02/2007
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01/31/2008
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Title:
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DIELECTRIC TRENCHES, NICKEL/TANTALUM OXIDE STRUCTURES, AND CHEMICAL MECHANICAL POLISHING TECHNIQUES
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06/21/2011
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12196065
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08/21/2008
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12/18/2008
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Title:
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DIELECTRIC TRENCHES, NICKEL/TANTALUM OXIDE STRUCTURES, AND CHEMICAL MECHANICAL POLISHING TECHNIQUES
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04/28/2015
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13042186
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03/07/2011
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09/13/2012
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Title:
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SUBSTRATES WITH THROUGH VIAS WITH CONDUCTIVE FEATURES FOR CONNECTION TO INTEGRATED CIRCUIT ELEMENTS, AND METHODS FOR FORMING THROUGH VIAS IN SUBSTRATES
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04/30/2013
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13181006
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07/12/2011
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01/17/2013
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Title:
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STRUCTURES WITH THROUGH VIAS PASSING THROUGH A SUBSTRATE COMPRISING A PLANAR INSULATING LAYER BETWEEN SEMICONDUCTOR LAYERS
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