Patent Assignment Details
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Reel/Frame: | 012561/0421 | |
| Pages: | 3 |
| | Recorded: | 01/28/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/10/2002
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Application #:
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10059932
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Filing Dt:
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01/28/2002
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Publication #:
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Pub Dt:
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08/15/2002
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Title:
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THREE-DIMENSIONAL MULTI-CHIP PACKAGE HAVING CHIP SELECTION PADS AND MANUFACTURING METHOD THEREOF
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Assignee
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PALDAL-KU, SUWON-CITY |
416 MAETAN-DONG |
KYUNGKI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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MARGER JOHNSON & MCCOLLM, P.C.
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ALAN T. MCCOLLOM
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1030 S.W. MORRISON STREET
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PORTLAND, OR 97205
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