Patent Assignment Details
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| Reel/Frame: | 013842/0421 | |
| Pages: | 6 |
| | Recorded: | 07/30/2003 | | |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE 1ST AND 3RD CONVEYING PARTIES PREVIOUSLY RECORDED ON REEL 013836 FRAME 0931. |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/10/2004
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Application #:
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10434256
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Filing Dt:
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05/07/2003
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Publication #:
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Pub Dt:
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04/22/2004
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Title:
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HEAT SPREADERS, HEAT SPREADER PACKAGES, AND FABRICATION METHODS FOR USE WITH FLIP CHIP SEMICONDUCTOR DEVICES
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Assignee
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| 5 YISHUN ST. 23 |
| SINGAPORE 768442, SINGAPORE |
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Correspondence name and address
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MIKIO ISHIMARU
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THE LAW OFFICES OF MIKIO ISHIMARU
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1110 SUNNYVALE-SARATOGA RD.
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SUITE A1
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SUNNYVALE, CA 94087
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