Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 065491/0422 | |
| Pages: | 5 |
| | Recorded: | 11/08/2023 | | |
Attorney Dkt #: | P202104187US01 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/30/2024
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Application #:
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17557529
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Filing Dt:
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12/21/2021
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Publication #:
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Pub Dt:
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06/22/2023
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Title:
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Electronic Package Structure With Offset Stacked Chips And Top And Bottom Side Cooling Lid
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Assignee
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NEW ORCHARD ROAD |
ARMONK, NEW YORK 10504 |
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Correspondence name and address
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IBM CORPORATION - PATENTS+ TEAM
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2800 37TH STREET NW
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ROCHESTER, MN 55901-4441
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09/22/2024 06:17 PM
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