Patent Assignment Details
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| Reel/Frame: | 059266/0424 | |
| Pages: | 4 |
| | Recorded: | 03/15/2022 | | |
| Attorney Dkt #: | TSMC 200048US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/05/2023
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Application #:
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17670955
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Filing Dt:
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02/14/2022
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Publication #:
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Pub Dt:
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02/09/2023
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Title:
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BOND WAVE OPTIMIZATION METHOD AND DEVICE
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Assignee
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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FAY SHARPE LLP
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1228 EUCLID AVE
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FLOOR 5
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CLEVELAND, OH 44115
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05/26/2024 12:19 PM
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