Patent Assignment Details
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Reel/Frame: | 012703/0425 | |
| Pages: | 5 |
| | Recorded: | 03/13/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/07/2004
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Application #:
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10096776
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Filing Dt:
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03/12/2002
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Publication #:
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Pub Dt:
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09/18/2003
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Title:
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ELECTRONIC ASSEMBLIES WITH SOLIDIFIED THIXOTROPIC THERMAL INTERFACE MATERIAL
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Assignee
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2200 MISSION COLLEGE BLVD. |
SANTA CLARA, CALIFORNIA 95052 |
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Correspondence name and address
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SCHWEGMAN, LUNDBERG, WOESSNER & KLUTH PA
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ANN M. MCCRACKIN
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P.O. BOX 2938
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MINNEAPOLIS, MN 55402
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