Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 043345/0426 | |
| Pages: | 3 |
| | Recorded: | 08/21/2017 | | |
Attorney Dkt #: | 18506-1176 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
10/29/2019
|
Application #:
|
15681776
|
Filing Dt:
|
08/21/2017
|
Publication #:
|
|
Pub Dt:
|
02/21/2019
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
|
|
Assignee
|
|
|
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN |
|
Correspondence name and address
|
|
WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS
|
|
2301 DUPONT DR. SUITE 510
|
|
IRVINE, CA 92612
|
Search Results as of:
09/22/2024 07:05 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|