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Reel/Frame:050074/0428   Pages: 4
Recorded: 08/16/2019
Attorney Dkt #:18817-302
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
16486637
Filing Dt:
08/16/2019
Publication #:
Pub Dt:
12/05/2019
Title:
A process for fabricating a substrate-less package and application thereof
Assignor
1
Exec Dt:
08/14/2019
Assignee
1
NO.1 JINSHAN ROAD JUEGANG TOWN NANTONG JIANSU
RUDONG COUNTY, CHINA
Correspondence name and address
WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS
8230 BOONE BLVD, SUITE 405
VIENNA, VA 22182

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