Patent Assignment Details
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| Reel/Frame: | 021255/0429 | |
| Pages: | 2 |
| | Recorded: | 07/17/2008 | | |
| Attorney Dkt #: | leo 003 pa |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/07/2010
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Application #:
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10580361
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Filing Dt:
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04/18/2007
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Publication #:
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Pub Dt:
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02/14/2008
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Title:
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PRODUCTION OF SEMICONDUCTOR SUBSTRATES WITH BURIED LAYERS BY JOINING (BONDING) SEMICONDUCTOR WAFERS
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Assignee
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| HAARBERGSTRASSE 67 |
| 99097 ERFURT, GERMANY |
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Correspondence name and address
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RICHARD C. STEVENS
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STEVENS & SHOWALTER LLP
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7019 CORPORATE WAY
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DAYTON, OH 45459-4238
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