Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 025936/0430 | |
| Pages: | 3 |
| | Recorded: | 03/10/2011 | | |
| Attorney Dkt #: | 27-429, 27-429.C1 & C1.D1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
3
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Patent #:
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Issue Dt:
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08/07/2007
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Application #:
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11022375
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Filing Dt:
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12/23/2004
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Publication #:
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Pub Dt:
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01/19/2006
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Title:
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SEMICONDUCTOR MULTIPACKAGE MODULE INCLUDING DIE AND INVERTED LAND GRID ARRAY PACKAGE STACKED OVER BALL GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
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04/06/2010
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Application #:
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11772776
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Filing Dt:
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07/02/2007
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Publication #:
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Pub Dt:
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12/06/2007
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Title:
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SEMICONDUCTOR MULTIPACKAGE MODULE INCLUDING DIE AND INVERTED LAND GRID ARRAY PACKAGE STACKED OVER BALL GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
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11/09/2010
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Application #:
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12699787
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Filing Dt:
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02/03/2010
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Publication #:
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Pub Dt:
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06/03/2010
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Title:
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METHOD FOR MAKING SEMICONDUCTOR MULTIPACKAGE MODULE INCLUDING DIE AND INVERTED LAND GRID ARRAY PACKAGE STACKED OVER BALL GRID ARRAY PACKAGE
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Assignee
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| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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LAW OFFICES OF MIKIO ISHIMARU
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333 W. EL CAMINO REAL
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SUITE 330
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SUNNYVALE, CA 94087
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