Patent Assignment Details
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Reel/Frame: | 055604/0431 | |
| Pages: | 4 |
| | Recorded: | 03/16/2021 | | |
Attorney Dkt #: | LIPOP452US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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11/22/2022
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Application #:
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17202632
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Filing Dt:
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03/16/2021
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Publication #:
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Pub Dt:
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09/23/2021
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Title:
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SEMICONDUCTOR PACKAGING SUBSTRATE, FABRICATION METHOD AND PACKAGING PROCESS THEREOF
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Assignee
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NO. 458-17, XINXING RD. |
HUKOU TOWNSHIP |
HSINCHU COUNTY, TAIWAN 30353 |
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Correspondence name and address
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AMIN, TUROCY & WATSON, LLP
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200 PARK AVENUE
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SUITE 300
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BEACHWOOD, OH 44122
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06/24/2024 02:56 AM
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