Patent Assignment Details
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| Reel/Frame: | 014846/0432 | |
| Pages: | 14 |
| | Recorded: | 07/13/2004 | | |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/26/2005
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Application #:
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10490484
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Filing Dt:
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03/23/2004
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Publication #:
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Pub Dt:
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10/21/2004
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Title:
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PACKAGE FOR ELECTRONIC PARTS, LID THEREOF, MATERIAL FOR THE LID AND METHOD FOR PRODUCING THE LID MATERIAL
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Assignee
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| 4-7-19, KITAHAMA, CHUO-KU |
| OSAKA-SHI, OSAKA 541-0041, JAPAN |
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Correspondence name and address
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KEATING & BENNETT, LLP
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JOSEPH R. KEATING
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10400 EATON PLACE, SUITE 312
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FAIRFAX, VA 22030
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