Patent Assignment Details
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Reel/Frame: | 034829/0433 | |
| Pages: | 6 |
| | Recorded: | 01/28/2015 | | |
Attorney Dkt #: | Q217337 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/15/2015
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Application #:
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14607265
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Filing Dt:
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01/28/2015
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Publication #:
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Pub Dt:
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05/21/2015
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Title:
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JIG, MANUFACTURING METHOD THEREOF, AND FLIP CHIP BONDING METHOD FOR CHIPS OF ULTRASOUND PROBE USING JIG
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Assignees
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129, SAMSUNG-RO, YEONGTONG-GU |
GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF 443-742 |
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KYUNGPOOK NATIONAL UNIVERSITY, 1370, |
SANGYEOK-DONG, BUK-GU |
DAEGU, KOREA, REPUBLIC OF |
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Correspondence name and address
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SUGHRUE MION, PLLC
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2100 PENNSYLVANIA AVENUE, N.W.
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SUITE 800
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WASHINGTON, DC 20037
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