Patent Assignment Details
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| Reel/Frame: | 008134/0434 | |
| Pages: | 4 |
| | Recorded: | 09/17/1996 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/06/1999
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Application #:
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08687723
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Filing Dt:
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07/26/1996
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Title:
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METHODS OF ETCHING THROUGH WAFERS AND SUBSTRATES WITH A COMPOSITE ETCH STOP LAYER
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Assignee
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| NAKAHARA-KU, KAWASAKI-SHI |
| 1-1, KAMIKODANAKA, 4-CHOME |
| KANAGAWA 211, JAPAN |
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Correspondence name and address
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COUDERT BROTHERS
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4 EMBARCADERO CENTER, SUITE 3300
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SAN FRANCISCO, CA 94111
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