Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 058730/0435 | |
| Pages: | 4 |
| | Recorded: | 01/21/2022 | | |
| Attorney Dkt #: | 157928.184806 (DC11997) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/03/2022
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Application #:
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16345704
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Filing Dt:
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04/27/2019
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Publication #:
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Pub Dt:
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11/14/2019
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Title:
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THERMALLY CONDUCTIVE SILICONE COMPOUND
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Assignee
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| 23F OTEMACHI FIRST SQUARE BUILDING |
| OTEMACHI, CHIYODA-KU |
| TOKYO, JAPAN 100-004 |
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Correspondence name and address
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WARNER NORCROSS + JUDD LLP
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150 OTTAWA AVE NW
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SUITE 1500
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GRAND RAPIDS, MI 49503-2832
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