Patent Assignment Details
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Reel/Frame: | 060483/0437 | |
| Pages: | 5 |
| | Recorded: | 07/12/2022 | | |
Attorney Dkt #: | 3531.149648 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17811969
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Filing Dt:
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07/12/2022
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Publication #:
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Pub Dt:
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01/26/2023
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Title:
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HARD WAFER GRINDING METHOD
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Assignee
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13-11, OMORI-KITA 2-CHOME, OTA-KU, |
TOKYO, JAPAN 143-8580 |
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Correspondence name and address
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GREER BURNS & CRAIN LTD.
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300 S. WACKER DRIVE
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CHICAGO, IL 60606
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09/26/2024 09:56 AM
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