Patent Assignment Details
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Reel/Frame: | 029961/0438 | |
| Pages: | 5 |
| | Recorded: | 03/11/2013 | | |
Attorney Dkt #: | 101P001374US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13792869
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Filing Dt:
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03/11/2013
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Publication #:
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Pub Dt:
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05/08/2014
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Title:
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ELECTRONIC DEVICE, SYSTEM PACKAGE MODULE AND METHOD OF MANUFACTURING SYSTEM PACKAGE MODULE
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Assignees
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NO. 1558, ZHANG DONG ROAD, ZHANGJIANG HI-TECH PARK |
SHANGHAI, CHINA 201203 |
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NO.141, LN. 351, SEC. 1, TAIPING RD., CAOTUN TOWNSHIP |
NANTOU COUNTY, CHINA 54261 |
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Correspondence name and address
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LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE
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2820 SHAWN LEIGH DR
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VIENNA, VA 22181
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