Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 068310/0438 | |
| Pages: | 32 |
| | Recorded: | 08/05/2024 | | |
| Attorney Dkt #: | AF8289-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18607259
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Filing Dt:
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03/15/2024
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Publication #:
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Pub Dt:
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09/18/2025
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Title:
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3D DIE STACK REDISTRIBUTION LAYER FOR TOPSIDE POWER DELIVERY TO BACKSIDE DIE METALLIZATION IN MULTICHIP COMPOSITE DEVICES
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Assignee
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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Correspondence name and address
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ADAM SAHAGIAN
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5 CENTERPOINTE DR. SUITE 400
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LAKE OSWEGO, OR 97035
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