Patent Assignment Details
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| Reel/Frame: | 009729/0439 | |
| Pages: | 3 |
| | Recorded: | 01/29/1999 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/24/2001
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Application #:
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09203464
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Filing Dt:
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12/02/1998
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Title:
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METHOD AND APPARATUS FOR SOLID BONDING, A CONDUCTOR BONDING METHOD, A PACKAGING METHOD, AND A BONDING AGENT AND A METHOD FOR MANUFACTURING A BONDING AGENT
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Assignee
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| SHINJUKU-KU |
| 4-1 NISHISHINJUKU 2-CHOME |
| TOKYO, JAPAN |
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Correspondence name and address
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EPSON RESEARCH AND DEVELOPMENT INC.
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ERIC B. JANOFSKY
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INTELLECTUAL PROPERTY DEPARTMENT
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225 BAYPOINTE PARKWAY
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SAN JOSE, CA 95134
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