Patent Assignment Details
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| Reel/Frame: | 010324/0441 | |
| Pages: | 2 |
| | Recorded: | 10/22/1999 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/28/2006
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Application #:
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09342801
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Filing Dt:
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06/29/1999
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Title:
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HERMETIC CHIP-SCALE PACKAGE FOR PHOTONIC DEVICES
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Assignee
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| AFRL/IFOJ |
| 26 ELECTRONIC PKWY |
| ROME, NEW YORK 13441 |
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Correspondence name and address
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AFRL/INFJ
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HAROLD L. BURSTYN
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26 ELECTRONIC PARKWAY
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ROME, NY 13441-4514
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