Patent Assignment Details
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Reel/Frame: | 014758/0442 | |
| Pages: | 3 |
| | Recorded: | 11/24/2003 | | |
Conveyance: | TO CORRECT ASSIGNEE NAME ON REEL/FRAME 014068/0555. |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10436046
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Filing Dt:
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05/13/2003
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Publication #:
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Pub Dt:
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02/12/2004
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Title:
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Micropattern forming material, micropattern forming method and method for manufacturing semiconductor device
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Assignee
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4-1, MARUNOUCHI 2-CHOME |
CHIYODA-KU |
TOKYO, JAPAN 100-6334 |
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Correspondence name and address
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LEYDIG, VOIT & MAYER
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JEFFREY A. WYAND
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700 13TH ST., N.W. SUITE 300
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WASHINGTON, D.C. 20005-3960
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