Patent Assignment Details
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Reel/Frame: | 019085/0442 | |
| Pages: | 5 |
| | Recorded: | 03/12/2007 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/19/2008
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Application #:
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11716601
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Filing Dt:
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03/12/2007
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Publication #:
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Pub Dt:
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09/13/2007
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Title:
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METHOD FOR CONCAVE GRINDING OF WAFER AND UNEVENNESS-ABSORBING PAD
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Assignee
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13-11, OMORI-KITA 2-CHOME, OTA-KU |
TOKYO, 143-8580, JAPAN |
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Correspondence name and address
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WENDEROTH, LIND & PONACK, L.L.P.
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ATTN: CHARLES R. WATTS, ESQ.
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2033 K STREET, N.W., SUITE 800
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WASHINGTON, DC 20006-1021
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