Patent Assignment Details
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| Reel/Frame: | 049857/0443 | |
| Pages: | 7 |
| | Recorded: | 07/25/2019 | | |
| Attorney Dkt #: | 920.020USWO |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/23/2021
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Application #:
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16465455
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Filing Dt:
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05/30/2019
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Publication #:
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Pub Dt:
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01/02/2020
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Title:
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Integrated circuit system and packaging method therefor
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Assignee
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| RM. 601, BUILDING 2, ZHONGJIAN INDUSTRIAL BUILDING, |
| NO. 18 YANSHAN ROAD, SHEKOU STREET, NANSHAN DISTRICT, |
| SHENZHEN, GUANGDONG, CHINA 518067 |
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Correspondence name and address
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BENJAMIN C. ARMITAGE
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7401 METRO BLVD.
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SUITE 425
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MINNEAPOLIS, MN 55439
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