Patent Assignment Details
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| Reel/Frame: | 022884/0447 | |
| Pages: | 2 |
| | Recorded: | 06/27/2009 | | |
| Attorney Dkt #: | 09188URL |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/03/2010
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Application #:
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12493171
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Filing Dt:
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06/27/2009
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Title:
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PACKAGE STRUCTURE PREVENTING SOLDER OVERFLOW ON SUBSTRATE SOLDER PADS
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Assignee
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| NO. 1245, JUNGHUA RD. |
| SHIN-WU SHIANG |
| TAOYUAN, TAIWAN |
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Correspondence name and address
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LIN & ASSOCIATES INTELLECTUAL PROPERTY,
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P.O. BOX 2339
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SARATOGA, CA 95070-0339
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