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Reel/Frame:055884/0447   Pages: 4
Recorded: 04/11/2021
Attorney Dkt #:10022-210001
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
08/09/2022
Application #:
17227319
Filing Dt:
04/11/2021
Publication #:
Pub Dt:
05/26/2022
Title:
PACKAGING STRUCTURE WITH RESILIENT POSITIONING FLAPS
Assignors
1
Exec Dt:
12/18/2020
2
Exec Dt:
12/18/2020
3
Exec Dt:
12/18/2020
Assignee
1
NO. 8, LI-SHING ROAD VII, HSINCHU SCIENCE PARK
HSINCHU CITY, TAIWAN
Correspondence name and address
C.I.P.O. IP GROUP
6F, 70-1, CHENG TEH ROAD, SEC. 1
TAIPEI CITY, TAIWAN

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