Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 061020/0447 | |
| Pages: | 4 |
| | Recorded: | 09/08/2022 | | |
| Attorney Dkt #: | 111P000581US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17939981
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Filing Dt:
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09/08/2022
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Publication #:
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Pub Dt:
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01/04/2024
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Title:
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PACKAGE SUBSTRATE AND METHOD FOR FABRICATING CHIP ASSEMBLY
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Assignee
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| 6 F., NO. 83, YANPING S. RD., ZHONGZHENG DIST., |
| TAIPEI CITY, TAIWAN 10043 |
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Correspondence name and address
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LI & CAI INTELLECTUAL PROPERTY OFFICE
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9F, NO. 69, SEC. 2 DUNHUA S. RD
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DA'AN DISTRICT
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TAIPEI, 106 TAIWAN
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