Patent Assignment Details
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Reel/Frame: | 014898/0448 | |
| Pages: | 3 |
| | Recorded: | 01/14/2004 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10756344
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Filing Dt:
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01/14/2004
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Publication #:
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Pub Dt:
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07/29/2004
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Title:
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Apparatus and method for aligning and attaching solder columns to a substrate
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Assignee
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23, SENJU HASHIDO-CHO |
ADACHI-KU, TOKYO, JAPAN |
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Correspondence name and address
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WENDEROTH, LIND & PONACK L.L.P.
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MICHAEL S. HUPPERT
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2033 K STREET, N.W., SUITE 800
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WASHINGTON, DC 20006-1021
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06/19/2024 09:42 PM
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