Patent Assignment Details
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Reel/Frame: | 054861/0448 | |
| Pages: | 8 |
| | Recorded: | 12/29/2020 | | |
Attorney Dkt #: | 203697/1173-668 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/29/2023
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Application #:
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17110837
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Filing Dt:
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12/03/2020
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Publication #:
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Pub Dt:
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11/11/2021
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Title:
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SELECTIVE MOLD PLACEMENT ON INTEGRATED CIRCUIT (IC) PACKAGES AND METHODS OF FABRICATING
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Assignee
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5775 MOREHOUSE DRIVE |
SAN DIEGO, CALIFORNIA 92121 |
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Correspondence name and address
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W&T/QUALCOMM
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106 PINEDALE SPRINGS WAY
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CARY, NC 27511
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09/21/2024 04:52 AM
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