Patent Assignment Details
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| Reel/Frame: | 038740/0449 | |
| Pages: | 4 |
| | Recorded: | 05/27/2016 | | |
| Attorney Dkt #: | 5649-3861 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/04/2016
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Application #:
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14334265
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Filing Dt:
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07/17/2014
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Publication #:
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Pub Dt:
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01/22/2015
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Title:
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TEMPORARY BONDING ADHESIVE COMPOSITIONS AND METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME
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Assignee
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| 6-1, OHTEMACHI |
| 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-004 |
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Correspondence name and address
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MYERS BIGEL & SIBLEY, P.A.
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PO BOX 37428
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RALEIGH, NC 27627
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