Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 020729/0450 | |
| Pages: | 3 |
| | Recorded: | 03/28/2008 | | |
| Attorney Dkt #: | 884.G94US1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/27/2010
|
Application #:
|
11425353
|
Filing Dt:
|
06/20/2006
|
|
Publication #:
|
|
Pub Dt:
|
12/20/2007
| | | | |
|
Title:
|
BULK METALLIC GLASS SOLDERS, FOAMED BULK METALLIC GLASS SOLDERS, FOAMED-SOLDER BOND PADS IN CHIP PACKAGES, METHODS OF ASSEMBLING SAME, AND SYSTEMS CONTAINING SAME
|
|
|
Assignee
|
|
|
|
|
| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95052 |
|
|
Correspondence name and address
|
| |
JOHN N. GREAVES
|
| |
SCHWEGMAN, LUNDBERG, WOESSNER, P.A.
|
| |
P.O. BOX 2938
|
| |
MINNEAPOLIS, MN 55402-0938
|
Search Results as of:
06/14/2024 03:39 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
