Patent Assignment Details
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| Reel/Frame: | 060857/0450 | |
| Pages: | 7 |
| | Recorded: | 08/22/2022 | | |
| Attorney Dkt #: | 28744-5641 (211009.1) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17818123
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Filing Dt:
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08/08/2022
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Publication #:
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Pub Dt:
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02/16/2023
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Title:
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SYSTEMS AND METHODS FOR PROCESSING SEMICONDUCTOR WAFERS USING FRONT-END PROCESSED WAFER GLOBAL GEOMETRY METRICS
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Assignee
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| NO. 8. INDUSTRIAL EAST ROAD 2 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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Correspondence name and address
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PATENT DOCKET DEPARTMENT ARMSTRONG TEASDALE LLP
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7700 FORSYTH BOULEVARD
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SUITE 1800
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ST. LOUIS, MO 63105
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