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Patent Assignment Details
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Reel/Frame:005438/0451   Pages: 3
Recorded: 09/10/1990
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST.
Total properties: 1
1
Patent #:
Issue Dt:
10/08/1991
Application #:
07580212
Filing Dt:
09/10/1990
Title:
METHOD FOR FORMING A MULTILEVEL INTERCONNECT STRUCTURE ON A SEMICONDUCTOR WAFER
Assignor
1
Exec Dt:
09/06/1990
Assignee
1
2805 E. COLUMBIA ROAD
BOISE, IDAHO 83706
Correspondence name and address
WELLS, ST. JOHN & ROBERTS
W. 601 MAIN AVENUE, STE. 815
SPOKANE, WA 99201-0679

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