Patent Assignment Details
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| Reel/Frame: | 020124/0451 | |
| Pages: | 3 |
| | Recorded: | 11/15/2007 | | |
| Attorney Dkt #: | MEG00-005D-E27 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/19/2009
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Application #:
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11927721
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Filing Dt:
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10/30/2007
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Publication #:
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Pub Dt:
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04/10/2008
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Title:
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POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF IC CHIPS
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Assignee
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| ROOM 301/302, NO. 47, PARK 2ND RD., |
| HSINCHU, TAIWAN 300 |
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Correspondence name and address
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MEGICA CORPORATION
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ROOM 301/302, NO. 47, PARK 2ND RD.,
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HSINCHU, 300 TAIWAN
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