Total properties:
42
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10908254
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Filing Dt:
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05/04/2005
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Publication #:
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Pub Dt:
|
11/03/2005
| | | | |
Title:
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INTEGRATED CIRCUIT PACKAGE WITH DIFFERENT HARDNESS BUMP PAD AND BUMP AND MANUFACTURING METHOD THEREFOR
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10934835
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Filing Dt:
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09/02/2004
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Publication #:
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Pub Dt:
|
03/02/2006
| | | | |
Title:
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Wire sweep resistant semiconductor package and manufacturing method thereof
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Patent #:
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NONE
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Issue Dt:
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|
Application #:
|
11035637
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Filing Dt:
|
01/14/2005
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Publication #:
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Pub Dt:
|
07/20/2006
| | | | |
Title:
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Under bump metallurgy in integrated circuits
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11162828
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Filing Dt:
|
09/24/2005
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Publication #:
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Pub Dt:
|
05/18/2006
| | | | |
Title:
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HYPER THERMALLY ENHANCED SEMICONDUCTOR PACKAGE SYSTEM
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Patent #:
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NONE
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Issue Dt:
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Application #:
|
11162971
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Filing Dt:
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09/29/2005
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Publication #:
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Pub Dt:
|
03/29/2007
| | | | |
Title:
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SUBSTRATE INDEXING SYSTEM
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Patent #:
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NONE
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Issue Dt:
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|
Application #:
|
11163313
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Filing Dt:
|
10/13/2005
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Publication #:
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|
Pub Dt:
|
04/19/2007
| | | | |
Title:
|
STACKED DIE PACKAGING SYSTEM
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Patent #:
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NONE
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Issue Dt:
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|
Application #:
|
11163547
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Filing Dt:
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10/21/2005
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Publication #:
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Pub Dt:
|
04/26/2007
| | | | |
Title:
|
PRE-MOLDED LEADFRAME AND METHOD THEREFOR
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Patent #:
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NONE
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Issue Dt:
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|
Application #:
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11276947
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Filing Dt:
|
03/17/2006
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Publication #:
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|
Pub Dt:
|
05/17/2007
| | | | |
Title:
|
INTEGRATED CIRCUIT PACKAGE SYSTEM
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|
Patent #:
|
NONE
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Issue Dt:
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|
Application #:
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11278002
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Filing Dt:
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03/30/2006
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Publication #:
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|
Pub Dt:
|
10/11/2007
| | | | |
Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH POST-PASSIVATION INTERCONNECTION AND INTEGRATION
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Patent #:
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NONE
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Issue Dt:
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|
Application #:
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11279741
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Filing Dt:
|
04/13/2006
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Publication #:
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|
Pub Dt:
|
05/17/2007
| | | | |
Title:
|
INTEGRATED CIRCUIT PACKAGE SYSTEM
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|
|
Patent #:
|
NONE
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Issue Dt:
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|
Application #:
|
11307317
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Filing Dt:
|
01/31/2006
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Publication #:
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|
Pub Dt:
|
08/02/2007
| | | | |
Title:
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INTEGRATED CIRCUIT SYSTEM WITH WAFERSCALE SPACER SYSTEM
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|
Patent #:
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NONE
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Issue Dt:
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|
Application #:
|
11307349
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Filing Dt:
|
02/01/2006
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Publication #:
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|
Pub Dt:
|
08/02/2007
| | | | |
Title:
|
INTEGRATED CIRCUIT PACKAGE SYSTEM HAVING DIE-ATTACH PAD WITH ELEVATED BONDLINE THICKNESS
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Patent #:
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NONE
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Issue Dt:
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|
Application #:
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11307498
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Filing Dt:
|
02/09/2006
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Publication #:
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Pub Dt:
|
05/17/2007
| | | | |
Title:
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STACKED INTEGRATED CIRCUITS PACKAGE SYSTEM
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Patent #:
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NONE
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Issue Dt:
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|
Application #:
|
11379018
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Filing Dt:
|
04/17/2006
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Publication #:
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|
Pub Dt:
|
10/18/2007
| | | | |
Title:
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MULTICHIP PACKAGE SYSTEM
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Patent #:
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NONE
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Issue Dt:
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|
Application #:
|
11380587
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Filing Dt:
|
04/27/2006
|
Publication #:
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|
Pub Dt:
|
05/17/2007
| | | | |
Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM
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|
|
Patent #:
|
NONE
|
Issue Dt:
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|
Application #:
|
11383802
|
Filing Dt:
|
05/17/2006
|
Publication #:
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|
Pub Dt:
|
11/22/2007
| | | | |
Title:
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SPACERLESS SEMICONDUCTOR PACKAGE CHIP STACKING SYSTEM
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Patent #:
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Issue Dt:
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09/08/2015
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Application #:
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11420853
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Filing Dt:
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05/30/2006
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Publication #:
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Pub Dt:
|
11/30/2006
| | | | |
Title:
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Epoxy Bump for Overhang Die
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Patent #:
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NONE
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Issue Dt:
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|
Application #:
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11458065
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Filing Dt:
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07/17/2006
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Publication #:
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Pub Dt:
|
05/17/2007
| | | | |
Title:
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INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM
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Patent #:
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NONE
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Issue Dt:
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|
Application #:
|
11469307
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Filing Dt:
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08/31/2006
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Publication #:
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|
Pub Dt:
|
01/04/2007
| | | | |
Title:
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BUMP FOR OVERHANG DEVICE
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Patent #:
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NONE
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Issue Dt:
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|
Application #:
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11532508
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Filing Dt:
|
09/15/2006
|
Publication #:
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|
Pub Dt:
|
03/20/2008
| | | | |
Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ENCAPSULATION LOCK
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Patent #:
|
NONE
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Issue Dt:
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|
Application #:
|
11672910
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Filing Dt:
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02/08/2007
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Publication #:
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Pub Dt:
|
08/14/2008
| | | | |
Title:
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SEMICONDUCTOR PACKAGE WIRE BONDING
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11749712
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Filing Dt:
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05/16/2007
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Publication #:
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Pub Dt:
|
11/20/2008
| | | | |
Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PERIMETER PADDLE
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Patent #:
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NONE
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Issue Dt:
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|
Application #:
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11767820
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Filing Dt:
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06/25/2007
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Publication #:
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Pub Dt:
|
12/25/2008
| | | | |
Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CAVITY SUBSTRATE
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Patent #:
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Issue Dt:
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05/03/2016
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Application #:
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11857188
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Filing Dt:
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09/18/2007
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Publication #:
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Pub Dt:
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03/19/2009
| | | | |
Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTI-CHIP MODULE
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Patent #:
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NONE
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Issue Dt:
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|
Application #:
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12055612
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Filing Dt:
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03/26/2008
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Publication #:
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Pub Dt:
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10/01/2009
| | | | |
Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH REDISTRIBUTION
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Patent #:
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Issue Dt:
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01/12/2016
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Application #:
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12056402
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Filing Dt:
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03/27/2008
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Publication #:
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Pub Dt:
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10/01/2009
| | | | |
Title:
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STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12122639
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Filing Dt:
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05/16/2008
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Publication #:
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Pub Dt:
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11/19/2009
| | | | |
Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM
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Patent #:
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Issue Dt:
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03/22/2016
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Application #:
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12182132
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Filing Dt:
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07/30/2008
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Publication #:
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Pub Dt:
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02/04/2010
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Title:
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RDL PATTERNING WITH PACKAGE ON PACKAGE SYSTEM
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Patent #:
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Issue Dt:
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03/22/2016
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Application #:
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12260089
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Filing Dt:
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10/28/2008
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Publication #:
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Pub Dt:
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04/29/2010
| | | | |
Title:
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SEMICONDUCTOR PACKAGE SYSTEM WITH CAVITY SUBSTRATE AND MANUFACTURING METHOD THEREFOR
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12408641
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Filing Dt:
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03/20/2009
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Publication #:
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Pub Dt:
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09/23/2010
| | | | |
Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL SIDED CONNECTION AND METHOD OF MANUFACTURE THEREOF
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Patent #:
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NONE
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Application #:
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12412886
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Filing Dt:
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03/27/2009
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Publication #:
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Pub Dt:
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09/30/2010
| | | | |
Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POST TYPE INTERCONNECTOR AND METHOD OF MANUFACTURE THEREOF
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Patent #:
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Issue Dt:
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05/31/2016
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12483548
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Filing Dt:
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06/12/2009
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Publication #:
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Pub Dt:
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12/16/2010
| | | | |
Title:
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INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM WITH REDISTRIBUTION AND METHOD OF MANUFACTURE THEREOF
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Patent #:
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Issue Dt:
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01/05/2016
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Application #:
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12542097
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08/17/2009
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Publication #:
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Pub Dt:
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02/17/2011
| | | | |
Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND METHOD OF MANUFACTURE THEREOF
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Patent #:
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NONE
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Application #:
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12563368
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Filing Dt:
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09/21/2009
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Publication #:
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Pub Dt:
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09/30/2010
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH AN INTEGRAL-INTERPOSER-STRUCTURE AND METHOD OF MANUFACTURE THEREOF
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Patent #:
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03/29/2016
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12714291
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02/26/2010
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Publication #:
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Pub Dt:
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09/09/2010
| | | | |
Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PATTERNED SUBSTRATE AND METHOD OF MANUFACTURE THEREOF
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Patent #:
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NONE
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12777615
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Filing Dt:
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05/11/2010
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Publication #:
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Pub Dt:
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11/18/2010
| | | | |
Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH COIN BONDED INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12819162
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Filing Dt:
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06/18/2010
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Publication #:
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Pub Dt:
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12/22/2011
| | | | |
Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FLIP CHIP MOUNTING AND METHOD OF MANUFACTURE THEREOF
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13038384
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Filing Dt:
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03/01/2011
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Publication #:
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Pub Dt:
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09/06/2012
| | | | |
Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADS AND METHOD OF MANUFACTURE THEREOF
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13039309
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Filing Dt:
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03/02/2011
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Publication #:
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Pub Dt:
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09/06/2012
| | | | |
Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BUMP BONDED DIES AND METHOD OF MANUFACTURE THEREOF
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13209837
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Filing Dt:
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08/15/2011
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Publication #:
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Pub Dt:
|
12/08/2011
| | | | |
Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INCREASED CONNECTIVITY AND METHOD OF MANUFACTURE THEREOF
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Patent #:
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Issue Dt:
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04/19/2016
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Application #:
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13211303
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Filing Dt:
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08/16/2011
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Publication #:
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Pub Dt:
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12/08/2011
| | | | |
Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MAGNETIC FILM AND METHOD OF MANUFACTURE THEREOF
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14341578
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Filing Dt:
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07/25/2014
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Publication #:
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Pub Dt:
|
11/13/2014
| | | | |
Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOUNTING STRUCTURE
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