Patent Assignment Details
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Reel/Frame: | 027592/0452 | |
| Pages: | 4 |
| | Recorded: | 01/25/2012 | | |
Attorney Dkt #: | 2262.000800 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/14/2014
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Application #:
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13357960
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Filing Dt:
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01/25/2012
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Publication #:
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Pub Dt:
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07/25/2013
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Title:
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Crack-Arresting Structure for Through-Silicon Vias
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Assignee
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60 WOODLANDS INDUSTRIAL PARK D STREET 2 |
SINGAPORE, SINGAPORE 738406 |
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Correspondence name and address
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J. MIKE AMERSON
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10333 RICHMOND, SUITE 1100
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HOUSTON, TX 77042
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09/22/2024 07:49 PM
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