Patent Assignment Details
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Reel/Frame: | 046126/0452 | |
| Pages: | 6 |
| | Recorded: | 06/19/2018 | | |
Attorney Dkt #: | 253/1163_00 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/22/2020
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Application #:
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16011759
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Filing Dt:
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06/19/2018
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Publication #:
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Pub Dt:
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05/16/2019
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Title:
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METHOD OF DEBONDING A CARRIER SUBSTRATE FROM A DEVICE SUBSTRATE, APPARATUS FOR PERFORMING THE SAME, AND METHOD OF SINGULATING SEMICONDUCTOR CHIPS INCLUDING THE SAME
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Assignee
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129, SAMSUNG-RO, YEONGTONG-GU |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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Correspondence name and address
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LEE & MORSE, P.C.
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3141 FAIRVIEW PARK DRIVE
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SUITE 500
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FALLS CHURCH, VA 22042
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