Patent Assignment Details
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Reel/Frame: | 053102/0455 | |
| Pages: | 4 |
| | Recorded: | 07/01/2020 | | |
Attorney Dkt #: | 2515.0425 DIV |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/11/2020
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Application #:
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15605010
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Filing Dt:
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05/25/2017
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Publication #:
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Pub Dt:
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09/14/2017
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Title:
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Semiconductor Device and Method of Forming Embedded Conductive Layer for Power/Ground Planes in FO-EWLB
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Assignee
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5 YISHUN STREET 23 |
SINGAPORE, SINGAPORE 768442 |
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Correspondence name and address
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PATENT LAW GROUP: ATKINS AND ASSOCIATES, P.C.
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123 W. CHANDLER HEIGHTS ROAD, #12535
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CHANDLER, AZ 85248
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