Patent Assignment Details
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Reel/Frame: | 053178/0457 | |
| Pages: | 5 |
| | Recorded: | 07/10/2020 | | |
Attorney Dkt #: | GF2-IBT-REL-SEC-AGMT |
Conveyance: | RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/11/2016
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Application #:
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14951634
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Filing Dt:
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11/25/2015
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Title:
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METHOD TO ACHIEVE ULTRA-HIGH CHIP-TO-CHIP ALIGNMENT ACCURACY FOR WAFER-TO-WAFER BONDING PROCESS
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Assignee
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P.O. BOX 309 |
UGLAND HOUSE |
GRAND CAYMAN, CAYMAN ISLANDS KY1-1104 |
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Correspondence name and address
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INVENSAS BONDING TECHNOLOGIES, INC.
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3025 ORCHARD PARKWAY
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SAN JOSE, CA 95134
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