Patent Assignment Details
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Reel/Frame: | 005705/0458 | |
| Pages: | 3 |
| | Recorded: | 05/02/1991 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/04/1992
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Application #:
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07694719
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Filing Dt:
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05/02/1991
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Title:
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METHOD OF MAKING A PLANARIZED THIN FILM COVERED WIRE BONDED SEMICONDUCTOR PACKAGE
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Assignee
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A CORPORATION OF NEW YORK |
ARMONK, NEW YORK 10504 |
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Correspondence name and address
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FRANCIS J. THORNTON
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IBM CORP., DEPT. 915, BLDG. 972-2
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ESSEX JUNCTION, VT 05452
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