Patent Assignment Details
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| Reel/Frame: | 011805/0460 | |
| Pages: | 3 |
| | Recorded: | 05/15/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/22/2002
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Application #:
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09854559
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Filing Dt:
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05/15/2001
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Publication #:
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Pub Dt:
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11/15/2001
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Title:
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SEMICONDUCTOR APPARATUS WITH IMPROVED THERMAL AND MECHANICAL CHARACTERISTIC UNDER-FILL
LAYER AND MANUFACTURING METHOD THEREFOR
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Assignee
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| 72 HORIKAWA-CHO, SAIWAI-KU |
| KAWASAKI-SHI, JAPAN |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOW, ET AL
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ERNEST F. CHAMPMAN
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1300 I STREET N.W.
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WASHINGTON, DC 20005-3315
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