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Patent Assignment Details
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Reel/Frame:014273/0460   Pages: 2
Recorded: 07/11/2003
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
03/21/2006
Application #:
10616932
Filing Dt:
07/11/2003
Publication #:
Pub Dt:
01/13/2005
Title:
Method of testing spacings in pattern of openings in PCB conductive layer
Assignor
1
Exec Dt:
07/10/2003
Assignee
1
1701 NORTH STREET
ENDICOTT, NEW YORK 13760
Correspondence name and address
ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
LAWRENCE R. FRALEY
1701 NORTH STREET
FBU/257-2 AA12
ENDICOTT, NY 13760

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