Patent Assignment Details
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| Reel/Frame: | 019482/0461 | |
| Pages: | 6 |
| | Recorded: | 06/27/2007 | | |
| Attorney Dkt #: | EIN P 2007 NAT 51 US 0 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11768919
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Filing Dt:
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06/27/2007
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Publication #:
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Pub Dt:
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12/27/2007
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Title:
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Semiconductor package has bump electrodes connected to metal pads, and passivation film provided on semiconductor chip surface other than upper surfaces of bump electrodes.
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Assignee
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| 133-704, SIBEOMDANJI SAMSUNG APT., SEOHYEON-DONG, BUNDANG-GU, SEONGNAM-SI, GYEONGGI-DO |
| SEONGNAM-SI, KOREA, REPUBLIC OF 463-050 |
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Correspondence name and address
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DEXTER CHIN
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8 KALLANG SECTOR
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EAST WING 7TH FLOOR
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SINGAPORE, 349282 SINGAPORE
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