Patent Assignment Details
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| Reel/Frame: | 023717/0462 | |
| Pages: | 5 |
| | Recorded: | 12/30/2009 | | |
| Attorney Dkt #: | YOU-17102/00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12667263
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Filing Dt:
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12/30/2009
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Publication #:
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Pub Dt:
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12/30/2010
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Title:
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METHAL-BASED PACKAGE SUBSTRATE, THREE-DIMENSIONAL MULTI-LAYERED PACKAGE MODULE USING THE SAME, AND MANUFACTURING METHOD THEREOF
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Assignees
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| 2305, SEMICONDUCTOR-DONG, KAIST, 373-1 |
| GUSEONG-DONG, YUSEONG-GU |
| DAEJEON, KOREA, REPUBLIC OF 305-701 |
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| 373-1, GUSEONG-DONG, YUSEONG-GU |
| DAEJEON-CITY, KOREA, REPUBLIC OF 305-701 |
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Correspondence name and address
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DOUGLAS W. SPRINKLE
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P.O. BOX 7021
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TROY, MI 48007
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