Patent Assignment Details
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Reel/Frame: | 057415/0463 | |
| Pages: | 3 |
| | Recorded: | 09/08/2021 | | |
Attorney Dkt #: | 890102.529 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/25/2023
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Application #:
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17081802
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Filing Dt:
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10/27/2020
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Publication #:
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Pub Dt:
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05/06/2021
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Title:
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SEMICONDUCTOR PROCESS CHAMBER WITH HEAT PIPE
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Assignee
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8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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SEED IP LAW GROUP LLP
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701 5TH AVE
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SUITE 5400
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SEATTLE, WA 98104
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