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Reel/Frame:057415/0463   Pages: 3
Recorded: 09/08/2021
Attorney Dkt #:890102.529
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
07/25/2023
Application #:
17081802
Filing Dt:
10/27/2020
Publication #:
Pub Dt:
05/06/2021
Title:
SEMICONDUCTOR PROCESS CHAMBER WITH HEAT PIPE
Assignors
1
Exec Dt:
09/06/2021
2
Exec Dt:
09/06/2021
Assignee
1
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondence name and address
SEED IP LAW GROUP LLP
701 5TH AVE
SUITE 5400
SEATTLE, WA 98104

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